ZENSUN Electronics (SHENZHEN) CO., LTD.

Heavy‑Copper Multilayer PCB

ENIG Finished Heavy‑Copper Power Bare PCB Energy storage BMS, charging modules, industrial power supplies

Mixed‑Signal Heavy‑Copper PCB, Industrial controllers, simultaneous high‑current and weak signal transmission

Mixed‑Signal Heavy‑Copper PCB Industrial controllers, for simultaneous high-current and weak signal transmission

Complex‑Trace Exposed‑Copper Heavy‑Copper PCB High-frequency power supplies, special power conversion boards

Heavy‑Copper Multilayer PCB for high‑current power applications, power supply, energy storage and industrial power control

Heavy‑Copper Multilayer PCB for high‑current power applications.Ideal for power supply, energy storage and industrial power control.

HDI high-density interconnect PCB

HDI 34-Layer 7-Level PCB

This high-density interconnect PCB features 34 layers, IT 180 material, 1 oz copper thickness, and 6.35 mm board thickness. With blind vias, a 25:1 aspect ratio, resin plugging, and selective thick gold plating, it is suitable for high-end communication, industrial control, and high-reliability electronic applications.

HDI 24‑Layer 5‑Level Bare PCB

Application: AI peripheral module, industrial motion controller, robot sensor main board

Description: Compact high‑density HDI bare board, fine trace & space design, reliable for multi‑channel signal transmission for automation equipment.

HDI 18‑Layer 4‑Level Bare PCB

Application: Robot servo control board, edge‑AI hardware, industrial I/O module

Description: Cost‑effective high‑order HDI bare PCB, stacked microvia structure, excellent signal integrity for edge artificial intelligence devices.

HDI 8‑Layer High‑Speed High‑Frequency Bare PCB

Application: Robot millimeter‑wave sensing board, industrial high‑speed bus board, AI vision radio frequency module Description: Isola high‑speed substrate bare board, stable dielectric performance, perfect for high‑speed sensing & vision hardware.

High‑Speed / RF PCB